H27U4G8F2DTR-BI

Product Overview

IC Picture

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Manufacturer Part No H27U4G8F2DTR-BI
Brand SK HYNIX
Item FLASH-NAND
Part No 512MX8 NAND SLC

Product Details

Package TSOP-48
Outpack
RoHS RoHS
Voltage 2.7V-3.6V
Temperature -40 C~+85 C
Speed 25 NS
Std. Pack Qty
Std. Carton

Description...................................................................................................................5 1.1 Product List....................................................................................................................................6 1.2 Pin description................................................................................................................................8 1.3 Functional block diagram...............................................................................................................9 1.4 Address role.................................................................................................................................10 1.5 Command Set...............................................................................................................................11 2 Bus Operations............................................................................................................................13 2.1 Command Input............................................................................................................................13 2.2 Address Input...............................................................................................................................13 2.3 Data Input....................................................................................................................................13 2.4 Data Output.................................................................................................................................13 2.5 Write Protect................................................................................................................................13 2.6 Stand-by......................................................................................................................................13 3 DEVICE OPERATION...................................................................................................................14 3.1 Page Read....................................................................................................................................14 3.2 Data Handiling Restriction During Program Sequences......................................................................14 3.3 Page Program...............................................................................................................................14 3.4 Multiple plane program..................................................................................................................15 3.5 Block Erase...................................................................................................................................15 3.6 Multiple plane Block Erase..............................................................................................................16 3.7 Copy-Back Program.......................................................................................................................16 3.8 Multiple plane copy back Program...................................................................................................17 3.9 Special read for copy back..............................................................................................................17 3.10 EDC Operation........................................................................................................................17 3.11 Read Status Register...................................................................................................................19 3.12 Read Status Enhanced.................................................................................................................19 3.13 Read Status Register field definition..............................................................................................20 3.14 Read EDC Status Register............................................................................................................20 3.15 Reset.........................................................................................................................................21 3.16 Cache Read................................................................................................................................21 3.17 Cache Program...........................................................................................................................22 3.18 Multi-plane Cache Program..........................................................................................................22 3.19 Read ID......................................................................................................................................24 3.20 Read ONFI Signature...................................................................................................................26 3.21 Read Parameter Page..................................................................................................................26 3.22 Parameter Page Data Structure Definition......................................................................................26 4 OTHER FEATURES.......................................................................................................................30 4.1 Data Protection and Power on / off sequence...................................................................................30 4.2 Ready/Busy..................................................................................................................................30 4.3 Write protect (#WP) handling........................................................................................................30 5 Device Parameters......................................................................................................................31 6 Timing Diagrams.........................................................................................................................35 7 Package Mechanical...............................................................................................................58 7.1 Power consumptions and pin capacitance for allowed stacking configurations.....................................59 8 Application notes and comments.............................................................................................60 8.1 System Interface using CE# don't care..........................................................................................60 8.2 System Bad Block Replacement....................................................................................................61 8.3 Bad Block Management System....................................................................................................

Available Offers

Description Qty Datecode
H27U4G8F2DTR-BI 3,840 Get Quote
H27U4G8F2DTR-BI 758 17+ Get Quote
H27U4G8F2DTR-BI 2,000 Get Quote
H27U4G8F2DTR-BI 10,000 Get Quote
H27U4G8F2DTR-BI 8,000 Get Quote
H27U4G8F2DTR-BI 14,000 Get Quote
H27U4G8F2DTR-BI 15,000 19+ Get Quote
H27U4G8F2DTR-BI 19,000 Get Quote
H27U4G8F2DTR-BI 7,680 Get Quote
H27U4G8F2DTR-BI 0 18+ Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
EN27LN4G08-25TIP TSOP-48 3.3 V 25 NS -40 C~+85 C
H27U4G8F2BTR-BI TSOP-48 2.7V-3.6V 25 NS -40 C~+85 C
H27U4G8F2DTR-BIR TSOP-48 2.7V-3.6V 25 NS -40 C~+85 C
H27U4G8F2ETR-BI TSOP-48 2.7V-3.6V 25 NS -40 C~+85 C
IS34ML04G081-TLI TSOP-48 3.3 V 25 NS -40 C~+85 C
IS34ML04G081-TLI-TR TSOP-48 3.3 V 25 NS -40 C~+85 C
IS34ML04G084-TLI TSOP-48 3.3 V 25 NS -40 C~+85 C
IS34ML04G084-TLI-TR TSOP-48 3.3 V 25 NS -40 C~+85 C
IS34ML04G088-TLI TSOP-48 3.3 V 25 NS -40 C~+85 C
IS35ML04G081-TLA TSOP-48 3.3 V 25 NS -40 C~+85 C