Package | TSOP2 |
Outpack | TRAY |
RoHS | RoHS |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 133 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 4M |
Bit Organization | x16 |
Density | 64M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 6th Gen. |
Power Consumption | low power |
Shipping Method | tray |
Description | Qty | Datecode | |
---|---|---|---|
HY57V641620ELT-H | 30,000 | Get Quote |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V641620HGT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V641620HGT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V641620HGT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V641620HGT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V641620HGT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V641620HGT-H/7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V641620HGT-H6.7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V641620HGT-K | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V641620HGT-P BK | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V641620HGTL-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |