Package | FBGA |
Outpack | TRAY |
RoHS | RoHS |
Voltage | 3.3 V |
Temperature | -40 C~+85 C |
Speed | 133MHz, CL3 3-3-3 |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 8M |
Bit Organization | x32 |
Density | 256M |
Package Material | Lead free |
Hynix Memory | HY |
Die Generation | 2nd Gen. |
Power Consumption | low power |
Shipping Method | tray |
Description | Qty | Datecode | |
---|---|---|---|
HY5V52ALFP-HI-C | 800 | 2000 | Get Quote |