Package | FBGA |
Outpack | TRAY |
RoHS | RoHS |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 166MHz, CL3 |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 8M |
Bit Organization | x32 |
Density | 256M |
Package Material | Lead free |
Hynix Memory | HY |
Die Generation | 6th Gen. |
Power Consumption | normal |
Shipping Method | tray |
Description | Qty | Datecode | |
---|---|---|---|
HY5V52EMP-6 | 100 | Get Quote |