K4T51163KUG-HCE6
Product Overview
Images are for reference only
| Manufacturer Part No | K4T51163KUG-HCE6 |
| Brand | SAMSUNG |
| Item | DDR2 SDRAM |
| Part No | 32MX16 DDR2 |
Product Details
| Package | FBGA-84 |
| Outpack | |
| RoHS | RoHS |
| Voltage | 1.8 V |
| Temperature | 0 C~+85 C |
| Speed | 667 MBPS |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 32M |
| Bit Organization | x16 |
| Density | 512M |
| Internal Banks | 4 Banks |
| Power | Low, i-TCSR & PASR & DS |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| MT47H32M16CC-37E:B | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| MT47H32M16CC-37E:B | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| MT47H32M16CC-37E:B/ROHS | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| MT47H32M16CC-37E:D | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| MT47H32M16CC-3:B | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| MT47H32M16CC-3:B MIC | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| MT47H32M16CC-3:D | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| MT47H32M16CC-3B | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| MT47H32M16CC-3D | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| MT47H32M16CC-3E | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |