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Manufacturer Part No | MT29F2G08ABAEAWP-AT:E |
Brand | MICRON |
Item | FLASH-NAND |
Part No | 256MX8 NAND SLC |
Alternate Names | MT29F2G08ABAEAWP-ATE |
Package | TSOP-48 |
Outpack | |
RoHS | RoHS |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 25 NS |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 256M |
Bit Organization | x8 |
Density | 2G |
Production Status | Production |
Package Material | Pb-free |
Interface | Async only |
Level | SLC |
Speed Grade | Async only |
Design Revision | T |
Package | TSOP I(48-pin CPL version) |
Classification | 1-1-1-1 (Die-nCE-RnB-IO Channels) |
General Description Micron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These devices use a highly multiplexed 8-bit bus (I/Ox) to transfer commands, address, and data. There are five control signals used to implement the asynchronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection and monitor device status (R/B#). This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, enabling future upgrades to higher densities with no board redesign. A target is the unit of memory accessed by a chip enable signal. A target contains one or more NAND Flash die. A NAND Flash die is the minimum unit that can independently execute commands and report status. A NAND Flash die, in the ONFI specification, is referred to as a logical unit (LUN). There is at least one NAND Flash die per chip enable signal. For further details, see Device and Array Organization. This device has an internal 4-bit ECC enabled. See Internal ECC and Spare Area Mapping for ECC for more information.
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
H27U2G8CTR-BCR | TSOP-48 | 2.7V-3.6V | 25 NS | 0 C~+70 C |
H27U2G8F2BTR-BC | TSOP-48 | 2.7V-3.6V | 25 NS | 0 C~+70 C |
H27U2G8F2C | TSOP-48 | 2.7V-3.6V | 25 NS | 0 C~+70 C |
H27U2G8F2CFR-BC | TSOP-48 | 2.7V-3.6V | 25 NS | 0 C~+70 C |
H27U2G8F2CTR-BC | TSOP-48 | 2.7V-3.6V | 25 NS | 0 C~+70 C |
H27U2G8F2CTR-BCR | TSOP-48 | 2.7V-3.6V | 25 NS | 0 C~+70 C |
H27U2G8F2DTR-B | TSOP-48 | 2.7V-3.6V | 25 NS | 0 C~+70 C |
H27U2G8F2DTR-BC | TSOP-48 | 2.7V-3.6V | 25 NS | 0 C~+70 C |
H27U2G8F2DTR-BCR | TSOP-48 | 2.7V-3.6V | 25 NS | 0 C~+70 C |
H27U2G8FCTR-BC | TSOP-48 | 2.7V-3.6V | 25 NS | 0 C~+70 C |