脚位/封装 | TSOP2 |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 133 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 8M |
Bit Organization | x16 |
Density | 128M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 2nd Gen. |
Power Consumption | low power |
Shipping Method | tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
HY57V281620HTC-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620PT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620T-6/7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620T-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620TC-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281622FTP-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281622HCT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281622HGT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281629AT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281629HCT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |