图片仅供参考
制造商IC编号 | W29N08GZBIBA |
厂牌 | WINBOND/華邦 |
IC 类别 | FLASH-NAND |
IC代码 | 1GX8 NAND SLC |
脚位/封装 | VFBGA-63 |
外包装 | |
无铅/环保 | 无铅/环保 |
电压(伏) | 2.7V~3.6V |
温度规格 | -40 C~+85 C |
速度 | 25 NS |
标准包装数量 | |
标准外箱 | |
Bit Organization | x8 |
Option Information | OTP command supported(contact winbond for option information) |
Product Family | ONFI compatible NAND flash memory |
Reserved | general product |
Company Prefix | winbond |
Product Version | G |
Supply Voltage Bus Width | 1.7~1.95V and X8 device |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
IS34ML08G088-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
K9F8G08UOAJIBO | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
S34ML08G101BHA000 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G101BHI00 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G101BHI000 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G101BHI003 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G101BHI003 63-BGA | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G101BHI003-63. | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G201BHA0 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G201BHA003 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |