MX29GL640EBTI-70G

产品概述

IC Picture

图片仅供参考

制造商IC编号 MX29GL640EBTI-70G
厂牌 MACRONIX/MXIC/旺宏
IC 类别 FLASH-NOR
IC代码 29GL640
共通IC编号 MX29GL640EBTI-70G-TRAY
MX29GL640EBTI-70GTR

产品详情

脚位/封装 TSOP-48
外包装 TRAY
无铅/环保 无铅/环保
电压(伏) 2.7V~3.6V
温度规格 -40 C~+85 C
速度 70 NS
标准包装数量 96
标准外箱

DESCRIPTION The block diagram illustrates a simplified architecture of this device. Each block in the block diagram represents one or more circuit modules in the real chip used to access, erase, program, and read the memory array. The "CONTROL INPUT LOGIC" block receives input pins CE#, OE#, WE#, RESET#, BYTE#, and WP#/ACC. It creates internal timing control signals according to the input pins and outputs to the "ADDRESS LATCH AND BUFFER" to latch the external address pins A0-AM. The internal addresses are output from this block to the main array and decoders composed of "X-DECODER", "Y-DECODER", "Y-PASS GATE", AND "FLASH ARRAY". The X-DECODER decodes the word-lines of the flash array, while the Y-DECODER decodes the bit-lines of the flash array. The bit lines are electrically connected to the "SENSE AMPLIFIER" and "PGM DATA HV" selectively through the Y-PASS GATES. SENSE AMPLIFIERS are used to read out the contents of the flash memory, while the "PGM DATA HV" block is used to selectively deliver high power to bit-lines during programming. The "I/O BUFFER" controls the input and output on the Q0-Q15/A-1 pads. During read operation, the I/O BUFFER receives data from SENSE AMPLIFIERS and drives the output pads accordingly. In the last cycle of program command, the I/O BUFFER transmits the data on Q0-Q15/A-1 to "PROGRAM DATA LATCH", which controls the high power drivers in "PGM DATA HV" to selectively program the bits in a word or byte according to the user input pattern. The "PROGRAM/ERASE HIGH VOLTAGE" block comprises the circuits to generate and deliver the necessary high voltage to the X-DECODER, FLASH ARRAY, and "PGM DATA HV" blocks. The logic control module comprises of the "WRITE STATE MACHINE, WSM", "STATE REGISTER", "COMMAND DATA DECODER", and "COMMAND DATA LATCH". When the user issues a command by toggling WE#, the command on Q0-A15/A-1 is latched in the COMMAND DATA LATCH and is decoded by the COMMAND DATA DECODER. The STATE REGISTER receives the command and records the current state of the device. The WSM implements the internal algorithms for program or erase according to the current command state by controlling each block in the block diagram. ARRAY ARCHITECTURE The main flash memory array can be organized as Byte mode (x8) or Word mode (x16). The details of the address ranges and the corresponding sector addresses are shown in Table 1.

供应链有货

IC 编号 数量 生产年份
MX29GL640EBTI-70G 5 索取报价
MX29GL640EBTI-70G 5,000 10+ 索取报价
MX29GL640EBTI-70G 2,880 17+ 索取报价
MX29GL640EBTI-70G 1,037 索取报价
MX29GL640EBTI-70G 40,000 索取报价
MX29GL640EBTI-70G 10,000 17+ 索取报价
MX29GL640EBTI-70G 10,368 索取报价
MX29GL640EBTI-70G 8,000 索取报价
MX29GL640EBTI-70G 15,000 18+ 索取报价
MX29GL640EBTI-70G 8,280 2010+ 索取报价

可替代IC编号

IC 编号 脚位/封装 电压(伏) 速度 温度规格
MX29LV640EBTI-70G TSOP-48 3.3 V 70 NS -40 C~+85 C

FFFE/互通料号 (形式,腳位和功能对等)

IC 编号 脚位/封装 电压(伏) 速度 温度规格
MX29GL640EBTI-70G 2335PCS TSOP-48 2.7V~3.6V 70 NS -40 C~+85 C
MX29GL640ETTI-70G TSOP-48 2.7V~3.6V 70 NS -40 C~+85 C
MX29GL640ETTI-70G-TR TSOP-48 2.7V~3.6V 70 NS -40 C~+85 C
MX29GL640ETTI-70G/TRAY TSOP-48 2.7V~3.6V 70 NS -40 C~+85 C
MX29GL640ETTS-70G TSOP-48 2.7V~3.6V 70 NS -40 C~+85 C